DIE ATTACH AND PACKAGE RELIABILITY

Essay specific features

 

Issue:

Technology

 

Written by:

David O

 

Date added:

February 6, 2013

 

Level:

 

Grade:

A

 

No of pages / words:

11 / 2903

 

Was viewed:

1543 times

 

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Essay content:

Its water extractable cations can form electrolytic solutions to trigger bond pad corrosion process and its anions cause dendrite growth. While the ion induced problems are becoming rare with modern resin purification technologies, and the occurrence of package crack in 260°C reflow reducing with the advance in mold compound technology, the interfacial delamination remains the main cause of package failure today...
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This en-ables the pad to be soldered directly to the board for better heat dissipating efficiency. Smaller exposed pad LQFPs have been in volume production for several years while the large ones continue to have delamination problem because of the higher CTE mismatch stress from the larger asymmetrically molded mold cap...
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