TSMC, The World's Largest Semiconductor Foundry,Selects Adexa To ...

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Jerome L


Date added:

March 31, 2014








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During its technology conference last week, TSMC also disclosed details about its roadmap in the chip-packaging front, including its internal efforts in the 3D arena. OIP is a program that involves more "collaboration between the foundry and its clients at the early stages of the design phase," said Jim Walker, an analyst with Gartner, in an e-mail newsletter...
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"OIP integrates TSMC's manufacturing technologies, silicon IP, massive manufacturing database and compatible third-party silicon IP and design tools," he said. "Through OIP, TSMC can offer vertically integrated services, from designing and manufacturing to testing and packaging, thus shortening clients' IC development processes and reducing their manufacturing costs," he said...
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